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Flex PCB (Enquiry pls send to Sales@pcba360.com )
XDF improve flex PCB capability to 10 layer board,rigid-flex pcb to 2-18layer .
Item | Description | ||
Layer |
Flex board: 1-12Layers Flex-Rigid Board: 2-18Layers |
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Material | PI, PET, PEN, FR-4,dupont | ||
Final Thickness |
Flex board: 0.002″ – 0.1″ (0.05-2.5mm) Flex-rigid board: 0.0024″ – 0.16″ (0.06-4.0mm) |
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Surface Treatment | Lead-free: ENG Gold; OSP, Immersion silver, Immersion Tin | ||
Max / Min Board Size | Min: 0.2″x0.3″ Max: 20.5″x13″ | ||
Min Trace Width / Min Clearance |
Inner: 0.5oz: 4/4mil Outer: 1/3oz-0.5oz: 4/4mil 1oz: 5/5mil 1oz: 5/5mil 2oz: 5/7mil 2oz: 5/7mil |
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Min Hole Ring |
Inner: 0.5oz: 4mil Outer: 1/3oz-0.5oz: 4mil 1oz: 5mil 1oz: 5mil 2oz: 7mil 2oz: 7mil |
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Copper Thickness | 1/3oz – 2oz | ||
Max / Min Insulation Thickness | 2mil/0.5mil (50um/12.7um) | ||
Min Hole Size and Tolerance |
Min hole: 8mil Tolerance: PTH±3mil, NPTH±2mil |
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Min Slot | 24mil x 35mil (0.6×0.9mm) | ||
Solder Mask Alignment Tolerance | ±3mil | ||
Silkscreen Alignment Tolerance | ±6mil | ||
Silkscreen Line Width | 5mil | ||
Gold Plating | Nickel: 100u” – 200u” | Gold: 1u”-4u” | |
Immersion Nickel / Gold | Nickel: 100u” – 200u” | Gold: 1u”-5u” | |
Immersion Silver | Silver: 6u” – 12u” | ||
OSP | Film: 8u” – 20u” | ||
Test Voltage | Testing Fixture: 50-300V | ||
Profile Tolerance of Punch | Accurate mould: ±2mil | ||
Ordinary mould: ±4mil | |||
Knife mould: ±8mil | |||
Hand-Cut: ±15mil |
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