XDF has long been known in the advanced electronic PCB materials industry for a very long time. With materials that “help strengthen, protect and connect our world,” XDF offers many high speed material‘s type to solve high frequency problems in many areas.
Rogers 5880/RT Durod5880 laminated materials are manufactured using the same high quality, reliable materials, and processes that Rogers has developed, allowing Rogers pcb to win major awards from manufacturers of high-frequency materials. In some designs, the dielectric properties of PCBs are critical. Whether it’s high-speed, RF, microwave or mobile, where power management is key, you’ll find more situations in your prototypes that require board dielectric properties than the standard FR-4 just cannot deliver. We know it. That’s why we’ve expanded our PCB Express with Rogers 5880 dielectric materials. These new low-loss dielectric materials mean higher performance for your demanding PCB prototypes.
The FR-4 material is the basic standard for PCB substrates and offers a highly effective balance between cost, manufacturing capacity, electrical properties, durability, and performance. But if electrical features and advanced performance are fundamental to your designs, Rogers materials are ideal for you because of:
XDF can now offer its RF PCB designs, microwaves and mobile devices with the industry-leading lead times, quality and abutment you expect from all our services, but now with better properties of PCB materials.
A dielectric material is a substance that is a poor electrical conductor and is used as an insulating layer in the PCB structure. Porcelain, mica, glass, plastics and some metal oxides are good dielectrics. The lower the dielectric loss (the amount of energy lost in the form of heat), the more effective the dielectric material will be. If the voltage in a dielectric material becomes too large, i.e. when the electrostatic field becomes too intense, the material suddenly starts to conduct the current. This phenomenon is called dielectric breakdown.
The contraction of “pre-impregnated composite fibers” and the production of PCBs, pre-pregs, affect the performance characteristics of the printed circuit board. A term also used in the PCB manufacturing industry to describe the materials of the bonding layer used to join the layers of a multilayer PCB.
The Rogers 5880 high-frequency laminate families are glass microfiber reinforced with PTFE compounds. These microfibers are statistically oriented to maximize the benefits of fiber gain in the most valuable direction for circuit producers and in end-use applications. The dielectric constant of these high-frequency laminates is the lowest of all products, and the low dielectric loss makes them suitable for high frequency/broadband applications where dispersion and losses must be minimized. Due to its extremely low water absorption properties, the RT Duroid 5880 is ideal for applications in high humidity environments.
These advanced circuit materials can be easily cut, sheared, and machined to form any solvents and reagents normally used in the circuit board or edge and hole plating. They have very low electrical loss for any reinforced PTFE material as well as they have also very low moisture absorption and are isotropic as well. They have uniform electrical properties on the frequency. High-frequency RT Duroid 5880 are used in circuits for commercial phone companies airlines, microstrip and stripline circuits, millimeter wave system applications used by military radar, missile systems antennas Digital Radio Point show and others. RT Duroid 5880 filled with PTFE compounds are designed for rigorous applications in integrated circuits and microcircuits.
Roger PCB materials have the lowest DK value for a copper laminate available on the market today. Due to its low dielectric constant of 1.96 at 10 GHz, RT Duroid 5880 supports broadband applications in microwave frequencies in the millimeter range, where dispersion and circuit losses must be minimized. It is a single – filling, lightweight PTFE compound with a very low density (1.37 g / cm3) and a low coefficient of thermal expansion (CTE) on the Z-axis providing high frequency manufacturing through (PTH) holes and enabling higher payloads of vehicles, In addition, the dielectric constant from the plate to the panel is uniform and constant over a wide frequency range, with a low Z-axis TCDk of +22ppm / ° C.
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